PVA TePla America - Plasma Processing System

PVA TePla America
Plasma Processing System

Plasma Cleaning is a dry, solvent free technology used to precision clean substrates at the molecular level. Precision cleaning is a requirement for a broad spectrum of industries with applications ranging from semiconductor wafer cleaning in micro-electronics to bio-burden decontamination of medical devices. Achieving and maintaining surface cleanliness at the molecular level during manufacturing unique methodologies.

Gas plasma cleaning removes surface contamination at the molecular level following machining, tooling and wet chemical processing steps. Plasma precision cleaning is a conformal process, not only for substrates of complex geometries but also on textured surfaces with “rough” topographies.

Since plasma cleaning is a dry process there are none of the liabilities associated with wet chemistry, such as exposure, chemical storage and waste disposal, health and safety restrictions on the use of dangerous solvents, solvent absorption into product, etc. This is the reason that plasma cleaning has earned itself the status “The green alternative to solvent cleaning”.

IoN 3B　

System Features:

Aluminum Chamber diamensions (W x D x H): 140mm x 200mm x 110mm
Variable power: 100 Watts
Gas Shower Head Integrated door
Single gas channel Mass Flow Controller for gas control, 50 sccm
View Port: 45mm dia.
Monitor: 7" touch screen, PC Interface
Operating mode: Up to 10 recipes with 10 steps can be stored
Pressure Measurement: Pirani Gauge

IoN 7B　

System Features:

Aluminum Chamber diamensions (W x D x H): 200mm x 220mm x 160mm
Variable power: 200 Watts
Gas Shower Head Integrated door
Single gas channel Mass Flow Controller for gas control, 100 sccm
View Port: 45mm dia.
Monitor: 7" touch screen, PC Interface
Operating mode: Upto 10 receipies with 10 steps can
Pressure Measurement: Pirani Gauge