Teltec Pacific is a technical Sales and Service organisation serving the Semiconductor, Photonics and Optoelectronics Industries in Asia Pacific countries.
Denton Vacuum
Since 1964 Denton Vacuum, LLC has designed and manufactured cutting edge thin film deposition systems for R&D and manufacturing. Proprietary systems, developed to customer specifications, and standard thin film systems are available. Several standard turnkey batch systems are available to fit any budget from research and development to manufacturing. We also offer fully automated modular in-line systems tailored to meet the specific needs of high volume manufacturing processes. Modularity allows for low cost upgrades in technology and enables rapid ramp up as volume increases. Our deposition technologies include PVD, PECVD, Magnetron Sputtering, Electron Beam Deposition, Ion Beam Enhanced Deposition, Ion Assisted Deposition, Plasma Sterilization, Reactive / Thermal Deposition, Sputtering and Reactive Ion Etching.
Our typical markets include Precision Optics, Opthalmics / Sunwear, Electronics, Electro-Optics, Telecommunications, Semiconductor Metallization, Thin Film R&D, Microscopy, Sample Preparation and Thermal Imaging.
Plasma-Enhanced Chemical Vapor Deposition (PECVD) is a process used to deposit thin films from a gas or liquid precursor to produce a specific thin film on a substrate. Precipitation of material is initiated by the creation of plasma and is generally RF frequency or DC discharge by electrodes. This electrically active coating area is filled with the reacting precursor. Applications for these processes include three dimensional or conformal coatings.
Explorer Series
Configurable for Sputtering, PVD, or PECVD applications
For use in R&D and batch production environments
Accepts up to 10" substrates
Vacuum chamber size 20" x 20" x 20" or Bell Jar up to 12" Dia. x 18" High
Automated touch screen controls or computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
Physical Vapor Deposition (PVD) is a coating method that involves purely physical processes such as high temperature vacuum evaporation by electron beam , resistive or ion beam sputter bombardment rather than involving a chemical reaction.
BTT IV
Configurable for Sputtering or PVD applications
For use in R&D and sample preparation environments
The Discovery® HDG
Ion Beam Deposition and Etch Platform The Discovery HDG provides a turnkey system for a range of processes: Ion Beam Deposition, Ion Beam Assisted Deposition, Ion Beam Etch, Reactive Ion Etch.
Features
Cool Substrate During Process
Tilting to Off Axis Angles
Rotation to 20 RPM
Discovery® HDG Brochure (Requires PDF reader)
Powerful Control System available in semi-manual mode or in fully automatic mode with one push automation to reduce system downtime.
Process Pro Upgrade Offers:
Consistent controls across all Denton Vacuum Products
Standard software makes it easy to support and avoid costly customization fees
Source code for your programs so you can customize your programs.
Network capabilities makes the discovery a node on your network enabling real-time, remote support and upgrades.
Convenient Access to Subsystems Rear or bottom mounted pumps provide easy access for service based on your workspace needs
Multiple Pumping Configurations A variety of cryogenic, mechanical and turbo pump configurations are available to fit your budget and process.
Typical Appications
Nanotechnology
Electronics
Semiconductor (Compound or Other)
Materials Research
Research & Development
Medical Devices
Precision Milling
Via Etching
Options
Evaporation
HDG Tilt Fixture, Single Rotation, 6” or 8” Diameter
HDG Tilt Fixture, Planetary Rotation, Three 6” Water Cooled Planets
Sputtering deposition is a method of depositing thin films by using ions for ejecting material from a target which deposits a thin film onto a substrate commonly using RF, DC or Pulsed DC power sources. Applications for sputtering include scalpels, bone saws, reamers, or any flat substrate.
